| 摘要 |
PURPOSE:To enhance the flexibility of design concept and improve reliability by connecting electrodes after burying the area other than the front and rear surfaces of semiconductor pellet in a substrate having an aperture under insulating layer. CONSTITUTION:After bonding a belt-shaped plate 11 having an adhesive layer 10 to a substrate 9 having an aperture 8, a semiconductor pellet 12 is bonded thereto. Then, after burying an insulator 13 in a gap between the pellet 12 and the substrate 9, it is hardened and both belt-shaped plate 11 and adhesive layer 10 are removed. An insulating layer 14 is formed on the entire part of surface and an aperture 15 is formed in order to establish electrical conductivity to electrodes. Thereafter a wiring layer 16 is formed and moreover protection films 17, 20 and a solder dip for external wiring are formed. Thereby, wiring by wire bonding is no longer necessary and flexibility of design concept and reliability can be improved. |
