| 摘要 |
Constructions of miniature bus bar assemblies which incorporate discrete capacitive elements having a high dielectric constant are presented herein. The capacitive elements are preferably metallized ceramic wafers which are bonded between a pair of bus bar conductors. In one embodiment bonding by strips of solder. In other embodiments, printed circuit elements are employed, both for electrical connection between the capacitor elements and the bus bars and to define the bus bars.
|
