| 摘要 |
Method and device for the multiple joining of electrical circuits on contiguous substrates, in which there is provided a jumper 10 with high density protruberances, having mushroom-shaped contact protruberance stretches 14 raised up at the two ends of a flexible circuit. The patterns of the interconnection elements with a protruberance which are located at each end of the jumper correspond, or are the symmetric reflection of patterns of tabs 18, 19, for joining the substrates to be connected 16, 17. The respectively corresponding patterns of interconnection elements are then paired up with the tabs for joining the substrates, and linked in a multiple manner to these tabs by reflux soldering, joining by thermocompression, fixing under pressure against a support plate, or by using a conductive linking agent. <IMAGE> |
