| 摘要 |
PURPOSE:To reduce the irregularity of liquid temperature by a method wherein the chemical liquid in a buffer vessel is pumped up using a pump, said liquid is supplied from the lower part of an etching vessel and is overflowed and fed back to the buffer vessel. CONSTITUTION:A buffer vessel 6 is provided in addition to an etching vessel 1, and a chemical liquid pressure-feeding pump 7 is provided on the buffer vessel 6. A pipeline is prvided between the pump 7 and the lower part of the etching vessel 1 through a heat exchanger 8 and a filter 9, and a feed back pipe 10 is provided between the etching vessel 1 and the buffer vessel 6. A chemical liquid 2 is pressure fed from the buffer vessel 6 using the pump 7, the chemical liquid 2 is directly heated or cooled by the heat exchanger 8, then it is purified by passing through a filter 9, said chemical liquid 2 is fed from the lower part of the etching vessel 1 and overflowed from the upper part of the etching vessel 1. The chemical liquid 2 overflowed from the etching vessel 1 is fed back to the buffer vessel 6 through the pipe 10 and pressure-fed to the etching vessel 1 again using the pump 7 for circulation. An etching process is performed on the semiconductor device in the etching vessel 1. |
