| 摘要 |
PURPOSE:To improve the sealability of resin with metal and to improve the moisture resistance of a semiconductor device by bonding a semiconductor pellet on a resin laminated board base, forming a connecting conductor to exterior, then sealing it with resin and containing the pellet in a molding unit. CONSTITUTION:An element pellet 5 is formed of a resin laminated board base 1 bonded with a semiconductor pellet 5, a connecting conductor 2 to exterior and sealing regin 8 and contained in a molding unit. The pellet 5 is bonded on a bed 3 of an epoxy-glass cloth laminated board 1, to which an element bonding side and back surface are connected to the conductor 2 of aluminum, and the wirings 4 of the conductor 2 and the element 5 are bonded via gold or aluminum wirings 6. Then, the element is sealed with resin 8 by phenol curable epoxy resin sealing material of molten silica substrate material, is then cut and separated by a cutter 7, and individually isolated at the unit parts. |
