| 摘要 |
PURPOSE:To enable to continuously prduce multikind parts of a small quantity as well as to reduce the percentage of rejects by a method wherein, after a lead frame has been pinched between forming materials and it has been formed in one body with a composite tablet, an element is die-inner bonded on the molded article and then said element is sealed by performing a potting. CONSTITUTION:After forming material tablets 6 and 6', consisting of phenol resin, epoxy resin and the like, have been arranged on the upper and lower surfaces of a metal lead frame and they have been formed in one body by performing a compression molding method, an element 2 is die-inner bonded 8 on a molded article 7, and then a resin-sealed type electronic part is obtained by sealing said element 2 using the casting material consisting of phenol resin, epoxy resin and the like. It is necessary that the forming material tablets are arranged on both upper and lower surfaces of the lead frame. Desirably, one each of said tablets is arranged on the upper and lower surfaces respectively. An activating process such as a pretreatment, for improvement of adhesive property between the forming material and the casting material, a coating treatment and the like may be performed. |
