| 摘要 |
PURPOSE:A resin composition which precures upon irradiation with actinic light and then fully cures by a heat-treatment, comprising a polyepoxy compound, a carboxyl group-containing photolymerizable compound, and a photosensitizer. CONSTITUTION:A curable resin composition is prepared by mixing (A) an epoxy compound containing at least two epoxy groups (e.g., bisphenol A-derived epoxy resin of an epoxy equivalent of about 100-4,000) with (B) a carboxyl group- containing photopolymerizable compound (e.g., monoacryloyloxyethyl succinate) (if necessary, together with other photopolymerizable compounds such as styrene compound) at an epoxy group/carboxyl group equivalent ratio of about 1:3-33:1 and further (C) about 0.05-20wt%, based on the total of components A and B, photosensitizer (e.g., benzyl dimethyl ketal). |
