| 摘要 |
PURPOSE:To make it possible to feed many kinds of wafer chips having different sizes, by selecting a sucking pin, which sucks the wafer chip and a pushing pin, which pushed up the wafer chip. CONSTITUTION:In correspondence with the size of a wafer chip 10 to be picked up, a sucking pin 13 and a pushing pin 16 are selected based on the instruction of a computer. By the driving of a cam, the sucking pin 13 is directed to the wafer chip 10 from the upper side and the pushing pin 16 is directed from the lower side. The wafer chip 10 is pushed by the pushing pin 16 and sucked by the vacuum sucking through a hole 13a of the sucking pin 13. Then only one wafer chip 10 is separated from a tacky tape 8. When the wafer chip 10 is lifted to a certain height, the pushing pin 16 is stopped, and the wafer chip 10 is held only by the sucking pin 13. The wafer chip 10 is moved to the upper part of a positioning table by the movement of a sucking pin slider. The pushing pin 16 is returned to the lower side. Finally, the wafer chip 10 is fed on the positioning table by the sucking pin 13. |
