| 摘要 |
PURPOSE:To supply efficiently a solder chip without damaging the same, by transferring and placing the solder chip blanked from a foillike solder tape by using a punch and die to a desired position by sucking the same under vacuum onto the forward end of a suction head. CONSTITUTION:A solder tape 1 which is put on horizontally between rolls 2 and 2 and is moved intermittently in an arrow direction by a feed pawl 5 and friction rolls 31, 32 in contact with a die 9 is blanked by means of a punch 7 which is moved upward in contact tightly with the tape 1 with the upward movement of a punch guide 8. A blanked solder chip 6 is forced upward on a punched hole 10. On the other hand, a suction head 12 mounted to the forward end of an arm 19 is lowered by the operation of the arm 19 and the air in a suction hole 14 is evacuated by a vacuum device (not shown), by which the blanked chip 6 is sucked to the forward end face of a head shaft 13. The head 12 is thereafter moved upward by the operation of the arm 19 to place the chip 6 on the desired position on the top surface of the substrate or the like. |
