| 摘要 |
PURPOSE:To braze a lead pin to a base metal with a minimum required brazing material and to make the brazing strength high, by using Ag solder including specified % of Ag, and performing the brazing in a reducing atmosphere. CONSTITUTION:When a lead pin for electronic parts, integrated circuit device, and the like are brazed to a base metal of surface Ni or an Ni alloy, an Ag solder including Ag of 92wt% or more is used and the brazing is performed in a reducing atmosphere. For example, the pure Ag solder 2 is plated on the brazing surface of a base part 1a with a diameter 1.0mm. of the lead pin 1 to a thickness of 20mum by a magnetron sputtering method. The lead pin 1 comprizes 47.5wt% of Fe-Ni whose diameter is 0.5mm. and length is 5mm.. Said lead pin 1 with pure Ag solder 2 is brazed on an Ni plated layer 3 for five minutes in an hydrogen atmosphere at 1,000 deg.C. The brazing without any useless spread of the brazing material, indicating the brazing strength of 9-11kg/mm.<2> in a tension breaking test, can be obtained. |
