| 摘要 |
<p>A connector (10) is described for electrical connection and, preferably, the removal of an array package (12) having a plurality of pins (14) with a substrate having contact elements (24). A first board (16) having a plurality of openings (22) formed therethrough and a second parallel board (18) having a plurality of complementary openings formed therethrough are interconnected by a heat- recoverable metal grid (20). One end of the grid is connected to the first board (16) and the other end of the grid is connected to the second board (18) to move the boards relative to each other to effect engagement between insertable elements, e.g. the contact elements (24) of the substrate and the pins (14) of an array package (12).</p> |
