发明名称 Gold sulphite electroplating solutions and methods
摘要 An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.
申请公布号 US4435253(A) 申请公布日期 1984.03.06
申请号 US19830461341 申请日期 1983.01.28
申请人 OMI INTERNATIONAL CORPORATION 发明人 BAKER, KENNETH D.;SCHEIDER, HANS
分类号 C25D3/48;C25D3/62;(IPC1-7):C25D3/48 主分类号 C25D3/48
代理机构 代理人
主权项
地址