| 摘要 |
PURPOSE:To avoid the adhesion of adhesive to the bonding part by a method wherein a recess is formed in an element or an element package, and excess adhesive is contained therein, when a color decomposing filter is adhered on a solid-state image pick-up element. CONSTITUTION:The solid-state image pick-up element 2 is contained in the bottom surface of the recess provided in the package 4, the color decomposing filter 1 is adhered on the surface thereof. Next, bonding pads 6 and 9 provided respectively on the element 2 and the package 4 are connected each other by means of metallic fine wires 5. In this constitution, recesses 7 and 8 are bored in the surface of the element 2 and at the bottom surface respectively by being positioned on both sides of the filter 1, the excess adhesive 3 of expanded adhesive 3 is contained into the recesses 7 and 8 when the filter 1 is fixed on the element 2 by dripping the photo setting type adhesive 3. Thereafter, the adhesive 3 is hardened by the irradiation of ultraviolet rays. In this manner, the excess adhesive 3 does not deposit on the pads 6 and 9. |
