| 摘要 |
PURPOSE:To prevent a void in solder from generating by a method wherein a projection or projection strip is formed around a solder layer formed on a cap. CONSTITUTION:A semiconductor element pallet 4 is fixed to the internal bottom surface of a cavity 3 of a ceramic base 1. Besides, a multiple layer processing part 7 comprising a metallized layer, an Ni plated layer and a gold plated layer is formed around the cavity 3. On the other hand, a solder layer 12 is formed on the inner surface of a cap 11 made of metallic sheet and a projection 13 is formed on the layer 12 of the peripheral part of the cap 11. The projection 13 is formed into a continuous project strip around the overall periphery of the cap 11. When the cap 11 placed on a base 1 so far formed is passed through an oven while the cap 11 is depressed, the layer 12 of the cap 11 is molten to fix the cap 11 to the base 1. At this time, the layer 12 is firstly molten into the projection strip 13 later expanding to be deposited on the base 1. Through these procedures, any air bubble in solder may be eliminated efficiently. |
