| 摘要 |
<p>PURPOSE:To obtain a photo detector of low cost and solidity by a method wherein a window through which light passes is opened at the center of a substrate composed of an alumina or flexible material, a semiconductor photo receving chip is arranged on the back surface of the substrate in opposition to this window, and the signal terminals thereof are fixed to wirings provided on the back surface of the substrate. CONSTITUTION:Wirings 13 are adhered on the back surface of a substrate 11 composed of an alumina or flexible material, and the photo transmission window 12 for the light passing through the center of the substrate 11 is opened by being positioned thereat. Next, the semiconductor photo receiving chip 14 is arranged on the back surface of the substrate 11 by corresponding to the window, and the signal terminal at both ends provided therein are fixed to the wirings 13 by means of conductors 15. Thus, the strength is increased without using wire bonding, and then the signal is taken out to the outside. Thereafter, the chip 14 is molded with resin 16, and accordingly the window 12 is blocked by fixing a clear plate 17 on the surface of the window 12 while the plate is extended on the substrate at the window edge. Thereby, the strength of the photo detector remarkably increases.</p> |
