MANUFACTURE OF SUBSTRATE FOR HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To manufacture a substrate for hybrid integrated circuit with high reliability as well as highly precise positions of wirings and electrodes by a method wherein the glass layers are printed and baked after forming a ceramic substrate by means of sintering the substrate materials. CONSTITUTION:A green sheet 1 made of Al2O3 printed with W layers 2 is sintered to form a ceramic substrate 1a. Firstly a part of W layers 2 is printed with the glass layers 3 to limit the space for electrode connection sintering said glass layers 3. Secondly the exposed part of said W layers 2 is Ni plated to print the wiring part of the ceramic substrate 1a e.g. with AgPd paste 5 for baking. Then the required substrate for hybrid integrated circuit is produced by means of solder soaking as necessary. In such a constitution, any exfoliation of wiring material AgPd and solder corrosion may be prevented from generating promoting the reliability of wiring and facilitating the element replacement in case of solder connection since the metallized layers 2, 4 are provided by means of a wetting process.