发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To adhere pellets firmly to respective islands by a method wherein the pellets are equipped to a lead frame by a conductive adhesive, and after the pellets are preliminarily heated holding the prescribed interval between a heater, the pellets are adhered closely to the heater to be heated. CONSTITUTION:The pellets 4 are equipped on the islands of the lead frame 3 using Ag paste, and the frame 3 is preliminarily heated at about 260 deg.C in a furnace 6 holding the prescribed interval 8 over the heater 7 heated at nearly 380 deg.C. After the prescribed hours, the frame 3 is adhered closely to the heater 7, and main heating is performed for the prescribed hours. By this two stage heating, because the hardener and the resin component of paste react completely to be hardened, adhesion is strong, and moreover because an air bubble is hard to remain in paste, and exfoliation of the pellet is hard to generate.
申请公布号 JPS5940538(A) 申请公布日期 1984.03.06
申请号 JP19820151605 申请日期 1982.08.30
申请人 NEC HOME ELECTRONICS KK 发明人 TARUI MASASHI;NANBU TETSUJI;MORIMOTO TOSHIHIRO;ODA KAZUTAKA
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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