| 摘要 |
PURPOSE:To prevent the damage of the chip part and a substrate by preheating the substrate while partially heating the chip part bonded with the substrate under a noncontacting state and removing the chip part by turning it while holding its side surface. CONSTITUTION:The substrate 1 with which a semiconductor chip 2 is bonded is placed on a susceptor 3, and held by holding members 4, 4'. The substrate 1 is preheated by a heater 5 set up to the susceptor 3. A high-temperature gas heater device 6 and arms 7, 7' are set at proper positions on the susceptor 3, and a high-temperature gas from the nozzle 6' of the device 6 is blown against the chip 2. The chip 2 is held by the arms 7, 7' by turning an operating bar 11, and the arms 7, 7' are turned by rotating a grip 12 in the horizontal direction. Accordingly, the chip 2 is exfoliated from the substrate 1. |
