| 摘要 |
PURPOSE:To prevent a slide between the wire and the tool, and to increase adhesive strength by forming a groove to the plane section of the nose of the bonding tool for the wire utilizing ultrasonic vibration. CONSTITUTION:The wire 1 is ball-bonded with a semiconductor circuit terminal 6 by the bonding tool 8, and bonded with an external substrate lead 5 by ultrasonic waves. The wire 1 is pushed against the external substrate lead 5 by the plane section 4 at that time. The grooves 7 are formed previously to the plane section 4 of the nose of the tool 8 at that time. Consequently, one part of the wire 1 is deformed to a shape along the plane section 4 and one part along the grooves 7. When ultrasonic vibration is applied to the tool 8 under the state, a slide is not generated between the wire and the tool 8 because one part of the wire 1 is held by the grooves 7. Accordingly, a relative motion is generated positively between the wire 1 and the lead 5, and adhesive strength is increased. |
