Method of fabricating electrical connections for hybrid circuit and hybrid circuit comprising such connections.

摘要

The subject of the invention is a method of fabricating electrical connections to which the components on "thin layer" hybrid circuits are connected. It consists in depositing on an insulating substrate a resistive layer A, a copper layer B, in carrying out their etching C then the stabilising of the resistors D, in undertaking the deoxidising of the copper E then its tinning F and finally the depositing of an insulating mask H accommodating the points for soldering the components onto the tinned copper. <IMAGE>