| 摘要 |
PURPOSE:To eliminate the necessity of providing wiring connection patterns on one side wiring layers by a method wherein the second heat resistant polymer resin layer is applied on the first heat resistant polymer resin layer and heat-hardened, and both side electrode wirings are connected by means of a connection window. CONSTITUTION:An insulation film 23 composed of the first heat resistant polymer resin layer is applied on a substrate 21 including a lower layer wiring layer 22, resulting in the formation of an even surface. Next, the surface of the hardened layer 23 is removed until the layer 22 expolses. Then, the second heat resistant polymer resin layer 24 is applied on the layer 23 including the layer 22 and hardened by heat treatment. A resist film 26 having a window 25 which exposes the surface of the region for forming the wiring connection window larger than the width of the layer 22 is provided on the layer 24, and accordingly the connection window 27 which exposes the upper surface of the wiring 22 to the layer 24 is formed. The wiring layer 28 which connects the layer 22 in the window 27 is formed on the layer 24. Thus, the surface of the layer 22 is made flat by the layer 23, and accordingly the layer 23 can prevent the generation of stepwise differences by utilizing its etching resistance at the time of the etching formation of the window 27. |
