| 摘要 |
<p>An integrated circuit package including a pin grid array is soldered to a printed circuit board (6). The tips (11) of the connection pins (5) of the circuit packages (1) protrude into plated- through holes (7) in the printed circuit board (6) and are soldered to the plated- through holes (7) at the side of the printed circuit board (6) adjacent the circuit package (2). The outer surface of the package (6) is preferably heated to melt solder positioned around the tips (11). <IMAGE></p> |
