| 摘要 |
PURPOSE:To prevent the decrease in performance of characteristic semiconductor elements by shortening heating time by a method wherein a glass layer having the unevenness of the softening point is provided on the junction surface between the package main body and the cap, which are adhered by heat-pressing at a low softening point. CONSTITUTION:The glass layers of both sides which fix the package main body 1 and the package cap 2 are decided as the glass layer 11 of a high softening point and the glass layer 12 of a low one, and the softening point is varied. This package is heated by a temperature lower than the high softening point of the glass layer 11 at the temperature corresponding to the low softening point of the glass layer 12 and thus pressed, resulting in adhesion. As a result, the glass layer 11 on the side of the main body 1 hardely deforms; only the glass layer 12 on the cap side joints to the upper surface of the glass layer 11 while softening and deforming, and accordingly is fixed by being cooled. In this case, the glass layer 11 does not soften and is not forced out by softening deformation; therefore the generation of a glass boundary surface in recess form is also eliminated. |
