| 摘要 |
PURPOSE:To prevent the yield of holes such as blowholes in glass and to obtain a highly reliable semiconductor device having the good appearance of the glass after sealing at a high yield rate, by using a low melting point sealing material at the inner and outer sides of a part to be sealed, using a high melting point sealing material at the intermediate side, and performing the sealing. CONSTITUTION:A base 5 and a cap 1 are sealed with sealing materials and a semiconductor element 6 is packaged in an airtight manner. In this type of an airtight package type semiconductor device, sealing materials 2-4 having the different melting points are used as the sealing materials. The low melting point sealing material 2 is used at the inner side of a part to be sealed. The high melting point sealing material 3 is used at the intermediate side of the part to be sealed. The low melting point material 4 is used at the outside. Thus the sealing is performed. For example, the low melting point glass 2 is applied on the inner side of the peripheral part of the back surface of the ceramic cap 1. The high melting point glass 3 is applied on the intermediate side. The low melting point glass 4 is applied on the outside. The base comprising a ceramic substrate and said cap are fused and field through a belt furnace for sealing. Thus blowholes are prevented, and the semiconductor device characterized by the good appearance and high commercial value is obtained. |
