发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To cause the charge transfer part to read signal charges like the frame accumulation mode to reduce the blooming by making common the readout gate to the charge accumulation part. CONSTITUTION:Charge accumulation portions 211-216 and a charge transfer part 22 are adjacently formed on a single surface of a semiconductor substrate 20, transfer electrodes 231-234 are insulated using an insulating film 24, and a part of accumulation portions 211-215 is exposed. These portions are integrally formed. Common signal readout gates 251, 252 are arranged to such accumulation portions 211-215 to read simultaneously the charges of the accumulation portions 211-215 adjacently provided in the vertical direction 26. The partial electrodes 231, 233 on the transfer part 22 are used also as the electrodes of gates 251, 252. A first electrode 27 is separately formed for each picture element so that a part of the substrate 20 is placed in contact with the accumulation portions 211-215. Moreover, a second electrode 30 is separately formed at a specified interval on the insulating layer 28 for each picture element, thereby reducing the blooming of a solid state image pickup device.
申请公布号 JPS62152159(A) 申请公布日期 1987.07.07
申请号 JP19850292034 申请日期 1985.12.26
申请人 TOSHIBA CORP 发明人 SHIBATA HIDENORI;KON TAKAO
分类号 H01L27/14;H01L27/146;H04N5/335;H04N5/351;H04N5/359;H04N5/369;H04N5/3728 主分类号 H01L27/14
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