A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components.
申请公布号
US4434434(A)
申请公布日期
1984.02.28
申请号
US19810249261
申请日期
1981.03.30
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BHATTACHARYA, SOMNATH;HU, SHIH-MING;KOOPMAN, NICHOLAS G.;OLDAKOWSKI, CHESTER C.
