发明名称 MOLDING METHOD OF LIQUID RESIN
摘要 PURPOSE:To manufacture a molded product in a short time, in a good efficiency and in an easy control of thickness by a method wherein liquid resin that has been injeced between forces holding a cavity and a core at desired clearances is heated and cooled. CONSTITUTION:A core 2 is inserted into a cavity 1 and liquid resin is injected from an injection hole 5 to the clearances between forces at the ordinary temperature. After injection of the liquid resin, heating medium is circulated from heating medium inlet pipes 3, 4 to the pipe embedded in the forces and the liquid resin is heated up to the melting temperature or reactive temperature suitable for the liquid resin. The resin that has been melted or reacted sufficiently is cooled by cooling medium and taken out as a molded product. In this way, since the force composed on a cavity and a core and having adjusted clearances are used a molded product with a desired thickness can easily be obtained.
申请公布号 JPS5935914(A) 申请公布日期 1984.02.27
申请号 JP19820146706 申请日期 1982.08.24
申请人 MITSUBISHI MONSANTO KASEI KK 发明人 NAKAZAWA TAKAO
分类号 B29B7/00;B29C31/00;B29C39/00;B29C39/10;B29C39/26;B29C39/38;B29C41/34;B29C41/40;B29C45/73 主分类号 B29B7/00
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