| 摘要 |
PURPOSE:To run stably and continuously an electroless copper plating soln. and to obtain stable deposited copper, by measuring the respective decreases in the concn. of the copper ions and the concn. of hydroxide ions in the electroless copper plating soln. and replenishing formalin according to the specific relation. CONSTITUTION:An electroless copper plating soln. of which the necessary compsn. and parameters are analyzed and measured and which is replenished by as much as the consumed components is controlled by the following method; The electroless copper plating soln. is analyzed and replenished of the compsn. except formalin according to need whereby the soln. is controlled. The decrease DELTACHCHO of the formalin is calculated by the relation from the decreases DELTACcu<2+> and DELTACOH<-> of the measured copper ions and hydroxide ions and the formalin is replenished. Absorptiometric method is used for determining the concn. of the copper ions and a pH measurement method using a glass electrode method is used for determining the hydroxide ions. A microcomputer is used for storing the measured values and calculating the consumption of the formalin. |
