| 摘要 |
PURPOSE:To improve the assembling efficiency and to reduce the cost of a semiconductor device by sealing with resin the periphery of a heat resistant member, and removing a flat heat resistant rubber plate to form a hole for exposing a bed and inner leads. CONSTITUTION:The bed and inner leads of a lead frame 11 are covered with a flat heat resistant rubber plate 12 (e.g., a flat Si rubber plate). Then, the periphery of the plate 12 is molded with resin 14, and the plate 12 is thereafter removed by heating or mechanical means. The bed 16 and the inner leads 17 are exposed in the hole 15 obtained by removing the plate 12. Subsequently, a pellet 18 is mounted on the bed 16, and wire bonded. Further, solutional, solid or pulverous molding resin 19 is filled in the hole 15, heated and polymerized and sealed with the resin. Thereafter, it is cut separately into sole units as products. |
