发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to inexpensively perform the formation of an ohmic contact electrode onto a semiconductor element by employing the steps of forming a oxidized metal film, forming the first and second metal layers and forming the ohmic contact electrode. CONSTITUTION:At least one of metal oxides selected from In2O3, SnO2, Sb2O5, Ta2O5, SiO2 is preferable as a reflection preventive film material, and among which In2O3, SnO2 forming conductive metal oxide in the form of In2O3 or SnO2 are preferable. Further, when these metal oxide film is formed, a doping material is added so as to enhance the conductivity, and when In2O3-SnO2 or SnO2- Sb2O5 is employed, the effect can be performed at best. One of metals of Ti, Ce, Sc, Zr, Hf, La, Y is effective as the metal having low oxide production energy from the Si used for the first metal layer. The metal used for the second layer is necessary to be selected from the metals of Ag, Au, Pt, Pd, Ni, Cr which are relatively stable for oxidation.
申请公布号 JPS5933885(A) 申请公布日期 1984.02.23
申请号 JP19820143204 申请日期 1982.08.20
申请人 HITACHI SEISAKUSHO KK 发明人 MATSUYAMA HARUHIKO;NAKATANI MITSUO;OKUNAKA MASAAKI;YOKONO ATARU;ISOGAI TOKIO;SAITOU TADASHI;MIDORIKAWA SUMIYUKI
分类号 H01L31/04;H01L21/28;H01L31/0224 主分类号 H01L31/04
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