| 发明名称 |
A THICK FILM COPPER CONDUCTOR COMPOSITION AND A DIELECTRIC SUBSTRATE HAVING A THIN LAYER OF THE COMPOSITION BONDED THERETO |
| 摘要 |
<p>Thick film copper conductor compositions useful for forming microwave conduit conductors are disclosed. The compositions contain copper, copper oxide, lead oxide and bismuth oxide dispersed in an inert liquid vehicle.</p> |
| 申请公布号 |
EP0028819(B1) |
申请公布日期 |
1984.02.22 |
| 申请号 |
EP19800106874 |
申请日期 |
1980.11.07 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
RELLICK, JOSEPH RICHARD |
| 分类号 |
H05K1/09;C04B41/51;C04B41/88;H01B1/14;H01B1/16;H01L27/01;(IPC1-7):01B1/16;04B41/14 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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