| 发明名称 |
PROCESS FOR HIGH SPEED NICKEL AND GOLD ELECTROPLATE SYSTEM |
| 摘要 |
<p>Improved corrosion resistance of cobalt-hardened gold plating is achieved by the electrodeposition of a ductile, low-stress nickel coating on the substrate prior to the electrodeposition of the cobalt-hardened gold plating. The resulting plated substrate or workpiece is also described and claimed.</p> |
| 申请公布号 |
CA1162505(A) |
申请公布日期 |
1984.02.21 |
| 申请号 |
CA19810386447 |
申请日期 |
1981.09.23 |
| 申请人 |
HOOKER CHEMICALS & PLASTICS CORP. |
发明人 |
ROSEGREN, DONALD R.;MAYER, LINDA J. |
| 分类号 |
C25D3/12;C25D3/48;C25D3/62;C25D5/12;(IPC1-7):C25D5/12 |
主分类号 |
C25D3/12 |
| 代理机构 |
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代理人 |
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| 地址 |
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