发明名称 MOLD FOR SEALING SEMICONDUCTOR WITH RESIN
摘要 PURPOSE:To seal a semiconductor with resin of high quality containing no void and high moisture resistance by providing a resin reservoir in a mold. CONSTITUTION:A resin reservoir gate 14 is opposed to a gate 12 in a cavity 11 in the lower mold of separable molds and formed to communicate at the other end with a resin reservoir 15. A cavity corresponding to the cavity 11 and an air vent hole are formed at the upper mold. Excess resin can be escaped through the gate 14 to the reservoir 15 at the molding time by forming the reservoir 15, thereby eliminating void therein, and effectively obtaining an excellent product which has high quality and high moisture resistance.
申请公布号 JPS5932139(A) 申请公布日期 1984.02.21
申请号 JP19820142918 申请日期 1982.08.18
申请人 TOKYO SHIBAURA DENKI KK 发明人 MIYAMOTO MITSUGI
分类号 B29C45/00;B29B7/00;B29C33/00;B29C35/00;B29C39/00;B29C39/10;B29C39/26;B29C45/14;B29C45/26;H01L21/56 主分类号 B29C45/00
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