| 摘要 |
PURPOSE:To attain the miniaturization and high reliability of a dummy load, by forming a resistor absorbing a microwave on an SiC substrate and connecting the assembly to one end of a microwave integrated circuit so as to decrease the temperature rise of a resistor. CONSTITUTION:A strip line 2 is formed on an alumina substrate 1. Further, the resistor 3 absorbing the microwave has the electric insulation and is formed on the SiC substrate 8 having a high heat conductivity and bonding pads 4, 6 are provided at both ends. The bonding pad 4 and the strip line 2 are connected with a gold ribbon 5. Further, the bonding pad 6 is connected to a ground conductor 9 with a gold ribbon 7. Since the resistor is provided on the SiC substrate having a good heat conductivity, the temperature rise of the resistor is reduced and the miniaturization and high reliability of the dummy load are attained. |
