| 摘要 |
PURPOSE:To unnecessitate the precision of positioning of a semiconductor element to a wiring substrate before soldering, and moreover to enable to solder other parts to be equipped outside at the same time in a reflowing oven by a method wherein the solder reflowing method to make the best use of the selfaligning effect is used. CONSTITUTION:The inner leads 1 of a film substrate 3 are connected to electrodes provided on one surface of the semiconductor element 4, and cut forming is performed. Then after the semiconductor substrate 4 thereof is positioned to the prescribed position on the wiring substrate 6 supplied with solder paste according to printing, etc., it is inserted in the reflowing oven to perform soldering. At this time, the position of the semiconductor element 4 is corrected by the selfaligning effect. Resin 9 is supplied by a syringe 10, etc., to the neighborhood of a gap formed between the back 4b of the semiconductor elemenet 4 and the surface 6a of the wiring substrate 6, and resin is made to invade into the gap due to the capillary phenomenon. |
