发明名称 |
COMPONENTE ELETTRONICO INTEGRATO DI TIPO SINGLE-IN-LINE EPROCEDIMENTO PER LA SUA FABBRICAZIONE. |
摘要 |
An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface. |
申请公布号 |
IT8419668(D0) |
申请公布日期 |
1984.02.17 |
申请号 |
IT19840019668 |
申请日期 |
1984.02.17 |
申请人 |
SGS ATES COMPONENTI ELETTRONICI S.P.A. ORA SGS THOMSON MICROELECTRO |
发明人 |
CARLO COGNETTI DE MARTIIS;GIUSEPPE MARCHISI |
分类号 |
H01L23/04;H01L21/02;H01L21/683;H01L23/02;H01L23/047;H01L23/367;H01L23/40;H01L23/50;(IPC1-7):A01L/ |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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