| 摘要 |
PURPOSE:To improve the yield of manufacturing a coil for a motor and to improve the reliability of the motor by coating an adhesive of semicured state between a flexible printed circuit board and resin to be molded, curing and adhering the resin simultaneously upon molding. CONSTITUTION:A circuit pattern 12 is formed by a film of copper on the surface of a flexible printed circuit board 11. A coil 13 is placed on the board 11, secured with an adhesive, and the ends of the coils 13 are connected to the pattern 12. Then, semicured resin 14 is coated on the board 11, and the coil 13 is then molded with resin 15. The resin 14 of the semicured state is cured in this case. In this manner, the bonding strength between the resin to be molded and the board can be increased, thereby providing a coil which improves the yield and has a high reliability. |
