| 摘要 |
PURPOSE:To provide an IC for driving a thermal head having a high assembling yield relative to the bonding of the IC by commonly connecting the ground side electrodes of two or more output transistors in the IC. CONSTITUTION:The emitters of two output transistors 3 are connected in an IC2, and two emitters are connected to one ground externally leading pad. Since two output transistors 3 commonly uses a ground pad, the number of pads decreases by half, thereby reducing the probability of generating improper bonding. When the number of output transistors 3 which commonly using a ground pad is similarly increased, the probability that a thermal head becomes improper due to improper bonding can be reduced inversely proportionally. |
