Multi-layer printed circuit board and method for determining the actual position of internally located terminal areas

摘要

A method and apparatus for locating terminal points on an internal conductive layer on an internal board section of a multi-layer printed circuit board assembly. Conductive locating patterns are arranged on the internal board section which are preferably fabricated by the same fabrication technique as for the conductive layer. An electrical probe such as a metal drill is then employed to locate the conductive pattern relative to a reference point. Such information is then used for drilling holes through the internal terminal points.