| 摘要 |
PURPOSE:To facilitate a process of mounting, and to increase mechanical strength in the case when the device is mounted to a package by preparing an electrode lead by a metallic foil made of a copper alloy having high stiffness and bonding the lead with a semiconductor base body by a solder material. CONSTITUTION:Cathode electrodes 105 and gate electrodes 106 being each in ohmic-contact with n emitters 104 and a p-base 103 and an anode electrode 107 being in ohmic-contact with a p emitter 101 are formed to several main surface of the base body 100. The electrode leads 109, 108 are bonded with the electrodes 106, 105 through solder layers 110. The leads 109, 108 are formed by copper alloy foils at that time. Accordingly, the reliability of the semiconductor device incorporated into the package can be improved. |
