发明名称 BONDING DEVICE
摘要 <p>PURPOSE:To prevent the oxidation of a lead frame, and to eliminate the variance of the progress of oxidation due to a time lag by setting up a shielding plate, which covers the opening section of a cover and to which a bonding work window is formed, so as to be interlocked with an XY table. CONSTITUTION:The shielding plate 52 is set up so as to cover the opening section 33a of the cover 33 fixed to a heating body 31. The shielding plate 52 is mounted so as to be interlocked with the XY table 45. Consequently, the bonding work window 52a formed to the shielding plate 52 may be formed in minimum size required for the bonding work of one transistor section. Accordingly, an inert gas flowing out of the inside of the cover 33 and air intruding to the inside of the cover 33 are suppressed at minimum, and the oxidation of the lead frame is prevented.</p>
申请公布号 JPS5925232(A) 申请公布日期 1984.02.09
申请号 JP19820132971 申请日期 1982.07.31
申请人 SHINKAWA:KK 发明人 USHIKI HIROSHI;KOBAYASHI TOMIO;ORITA KOUICHI;KADOSAWA MOTOAKI
分类号 B23K20/00;B23K1/00;H01L21/52;H01L21/58;H01L21/60 主分类号 B23K20/00
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