发明名称 VERFAHREN ZUM HERSTELLEN EINES SCHALTUNGSPLATTENVERBINDERS
摘要 A contact array plate having a plurality of contact pieces arranged to extend between first and second coupling pieces is formed by punching of a sheet of metal. A first housing half is molded integrally with the contact array plate so that intermediate portions of the contact pieces are buried in the first housing half. Then the first and second coupling pieces are cut off to separate the contact pieces from one another and outwardly projecting portions of the contact pieces are bent along shaped sections of the peripheral surface of the first housing half to form contact propers. A second housing half acting as bending dies is assembled with the first housing half with the contact propers inside thereof to define therebetween an insertion opening for receiving a mating connector.
申请公布号 DE3328390(A1) 申请公布日期 1984.02.09
申请号 DE19833328390 申请日期 1983.08.05
申请人 SONY CORP.;HOSIDEN ELECTRONICS CO.,LTD. 发明人 AMANO,KATUTOSHI;KAKUTA,TOSHIO
分类号 H01R13/504;H01R43/00;H01R43/16;H01R43/20;H01R43/24 主分类号 H01R13/504
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