Low cost electronic apparatus construction method.

摘要

A conductive interconnection pattern is transfer printed on the non-conducting interior surface of a first casing part. The pattern includes three sets of conductors and a number of key switch positions each having two conductors in proximity. An integrated circuit semiconductor is coupled to one set, an output device to the second set and a power supply to the third set of conductors. A second casing part has an opening positioned corresponding to the output device and a number of holes corresponding to the key switch positions of the interconnection patterns. A key is inserted into each hole, each key having a conductive portion for shorting the two proximate conductors and having a biasing device to prevent the shorting. The two casing parts are then coupled together. The method is also used for electronic games and learning aids.