| 摘要 |
PURPOSE:To facilitate the post-inspection of a semiconductor device having a pellet and an outer side bonding unit which is electrically conducted to the pellet by shortening the length of the bonding unit of the part which is not conducted with the pellet and facilitating the external observation from the other part. CONSTITUTION:A pellet 3 is bonded to a package which is secured to a lead frame 1 using a sealing glass 2. In other words, a bonding pad 4 and a lead frame 1 provided at the pellet 3 are connected via wirings 3', and electrically conducted to the exterior. In this structure, the lead pin 6 is not bonded, and only the pin 9 which is not conducted to the pellet 3 is intentionally shortened in the length. In this manner, the inspection is facilitated not only at the bonding time but also at the post-inspecting time. |
