| 摘要 |
PURPOSE:To eliminate a conventional frame by replacing a solder resist with photosensitive resist film and stopping the flow of the resin by this film. CONSTITUTION:A pattern of a copper foil 2 is formed on a glass epoxy resin substrate 1, a photosensitive resist film 3 is superposed, and heat-fusion bonded densely in vacuum. A wire bonding region 3a and a resin flow stopping region 3b are removed by exposure and developing. Then, a recess 5 is formed on the substrate 1, a chip 6 is secured, and connected with gold wirings 7. A cloth 8 immersed with sealing resin of epoxy resin mixed with black dye is placed on a chip 6. The cloth 8 is larger than the chip, and slightly smaller than the outer periphery of the bonding zone 3a. The resin is molten by heating to seal at 9 the chip 6, and flowed, but the edge of a weir is disposed nearly in a vertical manner and does not override the region 3b. Accordingly a conventional frame for stopping the flow is unnecessary, the number of parts and steps can be reduced, the amount of resin can be reduced to decrease the thickness. |
