Process for manufacturing a printed circuit board

摘要

The printed circuit board for mounting electronic parts thereon is obtained by transferring flux from a supporting film to the surface of a printed circuit board, and soldering the electronic parts thereto after the supporting film is removed. The supporting film is first coated with the flux, and the flux is transferred to the printed circuit board through the application of heat and pressure. Hot air can be blown from an oblique direction on the flux-coated surface of the printed circuit board after the flux is transferred thereto and before the electronic parts are soldered thereto. This method can provide a uniform flux coat on the printed circuit board and can eliminate various drawbacks which are encountered in conventional approaches in which the surface of the printed circuit board is coated directly with flux in liquid form.