| 摘要 |
PURPOSE:To reliably press-bond a connecting part while heating the part by forming a pressing tool of an infrared ray passing member and providing it with the function of condensing the infrared rays. CONSTITUTION:The upper end surface of a pressing tool 7 is formed in a raised surface to provide infrared ray condensing function, a groove for holding a fine wire W is formed on the lower end surface, the wire W is correctly positioned on a semiconductor pellet P and a lead frame D, and the wire W which is passed through a guide hole 11 of a holding tool 8 from a spool to the lower end surface of the tool 7. When the connecting part is press-bonded while heating, the wire can be reliably bonded even by the use of the member more inexpensive than Au. |
