| 摘要 |
PURPOSE:To enable to obtain systems having different functions by a method wherein bonding pads connected to integrated circuits are arranged as to surround the integrated circuits of the plural number, and the bonding pads thereof are selected. CONSTITUTION:The group of the integrated circuits 2 consisting of the integrated circuits I -VI is provided at the central part of a semiconductor chip 1, and moreover the bonding pads 3 of the plural number are arranged as to surround the group of the integrated circuits 2 at the circumferential part of the chip 1. The group of the pads I -VI is connected to the integrated circuits I -VI corresponding respectively. The system A can be constructed by selecting the group of the pads (provided that the group of the pads IV is excluded) surrounded by the alternate long and short dash line 4, and the system B can be constructed by selecting the group of the pads (provided that the group of the III is excluded) surrounded by the altenate long and two short dashes line 5. The systems A, B are constructed of the integrated circuits shown on the right sides of the following formulas. System A= I +III+IV+V. System B=II+IV+V+VI. |
