发明名称 LEADING STRUCTURE FOR ELECTRIC DEVICE
摘要 PURPOSE:To form a leading structure which can resist against high temperature and high pressure by integrally molding leading wirings with an insulating ring and a metal sealing ring, and pressing the flange of the lead of a frame through an O-ring by cooling hydraulic liquid. CONSTITUTION:The bare conductor 13a of an insulated wire 13 is soldered to the recess of a conductor 9 which has a collar 9a passing through a lead wiring hole of a frame 2. Then, the conductor 9, an insulating ring 11 made of epoxy resin or the like and a metal sealing ring 10 having an O-ring groove are integrally molded with rubber, plastic insulating film 12 in a mold, not shown, thereby forming an insulated conductor 14. O-rings 10a, 10b are inserted between a frame 2 and a metal sealing ring 10. The bare part 9b of the conductor 9 is led out of the frame 2, a nut 16 is screwed at 9c by holding an insulating support 15, and the conductor 9 is secured to the frame 2. High pressure of cooling sealing liquid 3 is acted to aid the effect of the O-ring 10b. In this manner, the seal which resists against high pressure and high temperature can be formed.
申请公布号 JPS5921247(A) 申请公布日期 1984.02.03
申请号 JP19820129815 申请日期 1982.07.26
申请人 TOKYO SHIBAURA DENKI KK;SHOWA DENSEN DENRAN KK 发明人 KAWAHARA KATSUSHIGE;YOSHIMITSU TETSUO;KAWASE MITSUO;KOJIMA RIYOUICHI;KOBAYASHI YUTAKA
分类号 H01F27/04;H02K5/132;H02K5/22 主分类号 H01F27/04
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