| 摘要 |
<p>PURPOSE:To improve strength and reliability in bonding with an outer lead of a printed wiring substrate, and to enable mount with high density by positively burying and setting up electrode terminals from the insulating layer of the surface of the bottom of the carrier and forming the carrier in structure in which the surface of the bottom and at least one part of the electrode terminals relatively have stepped differences. CONSTITUTION:A leadless chip carrier 20 is constituted approximately by an insulating layer 21, an electrode terminals 22 and a cap 23 for protecting an internal circuit, the electrode terminals 22 are particularly buried and set up from the insulating layer 21 of the surface of the bottom in the chip carrier 20, and structure in which these insulating layer 21 and electrode terminals 22 relatively shape stepped differences is formed. Accordingly, when the leadless chip carrier 20 is set up to the printed wiring substrate, the external leads of the substrate and the electrode terminals 22 do not adhere closely while melted solder collects in the electrode terminal 22 sections buried and set up, thus increasing the quantity of solder and the surface area related to bonding, then also improving adhesive strength largely.</p> |
